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1

Cu-Induced Dielectric Breakdown of Porous Low-Dielectric-Constant Film

Cheng, Yi-Lung, Lee, Chih-Yen, Huang, Yao-Liang, Sun, Chung-Ren, Lee, Wen-Hsi, Chen, Giin-Shan, Fang, Jau-Shiung, Phan, Bach Thang

Journal:

Journal of Electronic Materials

Year:

2017

Language:

english

File:

PDF, 732 KB

english, 2017

2

Comparison of O 2 plasma treatment on porous low dielectric constant material at sidewall and bottom of trench structure

Cheng, Yi-Lung, Lin, Bing-Hong, Lee, Chih-Yen, Chen, Giin-Shan, Fang, Jau-Shiung

Journal:

Thin Solid Films

Year:

2018

Language:

english

File:

PDF, 866 KB

english, 2018

3

Preparation and properties of porous polyimide films with TiO2/polymer double shell hollow spheres

Chi-Jung Chang, Mei-Hui Tsai, Giin-Shan Chen, Maw-Song Wu, Tsung-Wei Hung

Journal:

Thin Solid Films

Year:

2009

Language:

english

File:

PDF, 417 KB

english, 2009

4

Activation of amino-based monolayers for electroless metallization of high-aspect-ratio through-silicon vias by using a simple ultrasonic-assisted plating solution

Chen, Sung-Te, Cheng, Yu-Syun, Chang, Yiu-Hsiang, Yang, Tzu-Ming, Lee, Jyun-Ting, Chen, Giin-Shan

Journal:

Applied Surface Science

Year:

2018

Language:

english

File:

PDF, 1.34 MB

english, 2018

5

Comparison of Cu and Co Integration with Porous Low-k SiOCH Dielectrics

Cheng, Yi-Lung, Huang, Hong-Chang, Lee, Chih-Yen, Chen, Giin-Shan, Fang, Jau-Shiung

Journal:

Thin Solid Films

Year:

2020

File:

PDF, 605 KB

2020

6

Characterization of nanocrystalline manganese oxide powder prepared by inert gas condensation

Chin-Yi Chen, Chung-Kwei Lin, Ming-Hsiu Tsai, Chien-Yie Tsay, Pee-Yew Lee, Giin-Shan Chen

Journal:

Ceramics International

Year:

2008

Language:

english

File:

PDF, 1010 KB

english, 2008

7

Characterization of Ni57Zr20Ti18Al5 amorphous powder obtained by mechanical alloying

Pee-Yew Lee, Chung-Kwei Lin, I.-Kuan Jeng, Chien-Chung Wang, Giin-Shan Chen

Journal:

Materials Chemistry and Physics

Year:

2004

Language:

english

File:

PDF, 194 KB

english, 2004

8

Site-Selective Electroless Metallization on Porous Organosilica Films by Multisurface Modification of Alkyl Monolayer and Vacuum Plasma

Chen, Giin-Shan, Chen, Sung-Te, Chen, Yenying W., Hsu, Yen-Che

Journal:

Year:

2013

Language:

english

File:

PDF, 1.78 MB

english, 2013

9

Nanoseeding via Dual Surface Modification of Alkyl Monolayer for Site-Controlled Electroless Metallization

Chen, Sung-Te, Chen, Giin-Shan

Journal:

Year:

2011

Language:

english

File:

PDF, 2.77 MB

english, 2011

10

Searching for the formation of TiO2 mesoporous films with durable photoactivity by synergy of WO3 and sodium using a simple sputtering and annealing process

Chen, Giin-Shan, Cheng, Chiaohung

Journal:

Applied Catalysis B: Environmental

Year:

2014

Language:

english

File:

PDF, 4.31 MB

english, 2014

11

Synergy of sodium and WO3 for the formation of anatase-based TiO2 nanoporous films with enhanced photoactivity

Chen, Giin-Shan, Chen, Jiun-Heng, Kuo, Jenan, Chen, Yenying W., Niu, Huan

Journal:

Materials Letters

Year:

2013

Language:

english

File:

PDF, 1.00 MB

english, 2013

12

Formation of Cu-Zr-Ti Amorphous Alloys with Significant Supercooled Liquid Region by Mechanical Alloying

Desré, P.J., Lin, Chung Kwei, Chen, Giin Shan, Louh, Rong Fuh, Chen, K.C.

Journal:

Materials Science Forum

Year:

1999

File:

PDF, 406 KB

1999

13

Characterization of iron nitride powders formed by mechanical alloying and atmospheric heat treatment techniques

Lin, Chung‐Kwei, Chen, Giin‐Shan, Chen, Jium‐Shyong, Chin, Tsung‐Shune, Lee, Pee‐Yew

Journal:

Journal of the Chinese Institute of Engineers

Year:

2001

Language:

english

File:

PDF, 297 KB

english, 2001

14

[IEEE 2003 IEEE Conference on Electron Devices and Solid-State Circuits - Hong Kong, China (16-18 Dec. 2003)] 2003 IEEE Conference on Electron Devices and Solid-State Circuits (IEEE Cat. No.03TH8668) - Fabricating copper interconnects by displacement technology for ULSI

Chin-Hao Yang,, Don-Gey Liu,, Tsong-Jen Yang,, Wen-Luh Yang,, Giin-Shan Chen,

Year:

2003

Language:

english

File:

PDF, 269 KB

english, 2003

15

Self-powered n-MgxZn1-xO/p-Si photodetector improved by alloying-enhanced piezopotential through piezo-phototronic effect

Chen, Yen-Yu, Wang, Chao-Hung, Chen, Giin-Shan, Li, Yi-Chang, Liu, Chuan-Pu

Journal:

Year:

2015

Language:

english

File:

PDF, 2.41 MB

english, 2015

16

Phase transition behavior of reactive sputtering deposited Co–N thin films using transmission electron microscopy

Fang, Jau-Shiung, Yang, Li-Chung, Hsu, Chen-Siang, Chen, Gin-Shiang, Lin, Yen-Wei, Chen, Giin-Shan

Journal:

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

Year:

2004

Language:

english

File:

PDF, 1.53 MB

english, 2004

17

Microstructure and Properties of Vacuum Hot-Pressing SiC/ Ti-Cu-Ni-Sn Bulk Metallic Glass Composites

Lin, Hong Ming, Chen, Giin Shan, Lee, Pee Yew

Journal:

Key Engineering Materials

Year:

2007

Language:

english

File:

PDF, 349 KB

english, 2007

18

Formation of Cu-Zr-Ti Amorphous Alloys with Significant Supercooled Liquid Region by Mechanical Alloying

Desré, P.J., Lin, Chung Kwei, Chen, Giin Shan, Louh, Rong Fuh, Chen, K.C.

Journal:

Journal of Metastable and Nanocrystalline Materials

Year:

1999

File:

PDF, 417 KB

1999

19

Solid State Amorphization of Fe50Nb50 Powders during Mechanical Alloying

Lin, Chung Kwei, Desré, P.J., Kao, S.W., Chen, Giin Shan, Louh, Rong Fuh, Hwu, Y.K.

Journal:

Materials Science Forum

Year:

1999

File:

PDF, 415 KB

1999

20

Formation of Ni57Zr20Ti22Pb1 Amorphous Powders by Mechanical Alloying

Lee, Pee Yew, Hung, S.S., Jang, Jason S.C., Chen, Giin Shan

Journal:

Materials Science Forum

Year:

2007

Language:

english

File:

PDF, 2.83 MB

english, 2007

21

Solid State Amorphization of Fe50Nb50 Powders during Mechanical Alloying

Lin, Chung Kwei, Desré, P.J., Kao, S.W., Chen, Giin Shan, Louh, Rong Fuh, Hwu, Y.K.

Journal:

Journal of Metastable and Nanocrystalline Materials

Year:

1999

File:

PDF, 414 KB

1999

22

Ultrathin cobalt-alloyed barrier layers for copper metallization by a new seeding and electroless-deposition process

Chen, Sung-Te, Liu, Yuan-Yu, Chen, Giin-Shan

Journal:

Applied Surface Science

Year:

2015

Language:

english

File:

PDF, 1.84 MB

english, 2015

23

Atomic layer deposition HfO2 capping layer effect on porous low dielectric constant materials

Cheng, Yi-Lung, Kao, Kai-Chieh, Huang, Chi-Jia, Chen, Giin-Shan, Fang, Jau-Shiung

Journal:

Applied Surface Science

Year:

2015

Language:

english

File:

PDF, 1.16 MB

english, 2015

24

Effect of annealing temperature on electrical and reliability characteristics of HfO2/porous low-k dielectric stacks

Cheng, Yi-Lung, Kao, Kai-Chieh, Chen, Giin-Shan, Fang, Jau-Shiung, Sun, Chung-Ren, Lee, Wen-Hsi

Journal:

Microelectronic Engineering

Year:

2016

Language:

english

File:

PDF, 1.56 MB

english, 2016

25

Electroless plating of low-resistivity Cu–Mn alloy thin films with self-forming capacity and enhanced thermal stability

Chen, Sung-Te, Chen, Giin-Shan

Journal:

Journal of Alloys and Compounds

Year:

2015

Language:

english

File:

PDF, 1.23 MB

english, 2015

26

Ultimate limits of lithography

Morgan, Chris, Shan Chen, Giin, Boothroyd, Chris, Bailey, Simon, Humphreys, Collin

Journal:

Year:

1992

Language:

english

File:

PDF, 9.74 MB

english, 1992

27

Enhancement of Seeding and Electroless Cu Plating on TaN Barrier Layers: The Role of Plasma Functionalized Self-Assembled Monolayers

Chen, Giin-Shan, Wu, Ding-Ye, Chen, Sung-Te, Cheng, Yi-Lung, Fang, Jau-Shiung, Yang, Tzu-Ming

Journal:

Journal of The Electrochemical Society

Year:

2016

Language:

english

File:

PDF, 1.19 MB

english, 2016

28

Enhancement of seeding for electroless Cu plating of metallic barrier layers by using alkyl self-assembled monolayers

Chen, Sung-Te, Chung, Yu-Cheng, Fang, Jau-Shiung, Cheng, Yi-Lung, Chen, Giin-Shan

Journal:

Applied Surface Science

Year:

2017

Language:

english

File:

PDF, 1.18 MB

english, 2017

29

The photocatalytic degradation of methylene blue by green semiconductor films that is induced by irradiation by a light emitting diode and visible light

Yang, Chih-Chi, Doong, Ruey-An, Chen, Ku-Fan, Chen, Giin-Shan, Tsai, Yung-Pin

Journal:

Journal of the Air & Waste Management Association (1995-)

Year:

2017

Language:

english

File:

PDF, 14.55 MB

english, 2017

30

A new alternative self-assembled-monolayer activation process for electroless deposition of copper interconnects without a conventional barrier

Chen, Giin-Shan, Yang, Tzu-Ming, Chen, Sung-Te, Cheng, Yi-Lung, Fang, Jau-Shiung

Journal:

Electrochemistry Communications

Year:

2018

Language:

english

File:

PDF, 737 KB

english, 2018

31

Comparison of various low dielectric constant materials

Cheng, Yi-Lung, Lee, Chih-Yen, Hung, Wei-Jie, Chen, Giin-Shan, Fang, Jan-Shiung

Journal:

Thin Solid Films

Year:

2018

Language:

english

File:

PDF, 5.34 MB

english, 2018

32

Electrical and reliability characteristics of dielectric stack with low dielectric constant SiCOH and capping SiCNH films

Cheng, Yi-Lung, Lee, Chih-Yen, Hung, Wei-Jie, Chen, Giin-Shan, Fang, Jau-Shiung

Journal:

Surface and Coatings Technology

Year:

2018

Language:

english

File:

PDF, 4.07 MB

english, 2018

33

A 2-nm-Thick Mn Oxide on a Nitrogen-Stuffed Porous Carbon-Doped Organosilica as a Barrier of Cu Films

Fang, Jau-Shiung, Yu, Kuang-Yu, Wang, Yi-Sheng, Chen, Giin-Shan, Cheng, Yi-Lung

Journal:

ECS Journal of Solid State Science and Technology

Year:

2018

Language:

english

File:

PDF, 528 KB

english, 2018

34

Self-strengthening of electroless-plated copper via dual segregation of extremely dilute (0.1%) manganese oxide inclusions

Chen, Giin-Shan, Tau, Ren-Jie, Chen, Sung-Te, Chen, Yen-Chin, Cheng, Yi-Lung, Fang, Jau-Shiung

Journal:

Materials Letters

Year:

2019

Language:

english

File:

PDF, 998 KB

english, 2019

35

Reliability Enhancement of Copper/Porous SiOCH Metallization Systems Using Nitrogen Stuffing and Bias-Filter Sputter Deposited Mn 2 O 3 Barrier

Fang, Jau-Shiung, Yu, Kuang-Yu, Chen, Sung-Te, Cheng, Yi-Lung, Wang, Yi-Sheng, Chen, Giin-Shan

Journal:

ECS Journal of Solid State Science and Technology

Year:

2019

File:

PDF, 752 KB

2019

36

Anodization of Tantalum Films for the Enhancement of Monolayer Seeding and Electroless Copper Plating

Chen, Giin-Shan, Cho, An-Chi, Chen, Sung-Te

Journal:

Journal of The Electrochemical Society

Year:

2020

File:

PDF, 1.10 MB

2020

37

Mechanism of strengthening electroless plated copper films with extremely dilute oxide dispersion alloying: the optimal MnO addition

Chen, Giin-Shan, Tau, Ren-Jie, Fang, Jau-Shiung, Cheng, Yi-Lung, Chen, Yen-Chin

Journal:

Applied Surface Science

Year:

2020

File:

PDF, 1.45 MB

2020

38

Electrochemical Anodization of 2-nm-Thick Tantalum Films for Self-Assembling of Molecularly Thick Layer as a Barrier for Copper

Chen, Giin-Shan, Ch, An-Chi, Chen, Sung-Te, Chen, Yen-Chin

Journal:

Journal of The Electrochemical Society

Year:

2020

File:

PDF, 643 KB

2020

39

Synergy of mercaptosilane monolayer embedding and extremely dilute cobalt alloying for metallization of copper without a conventional metallic barrier

Chen, Giin-Shan, Gao, Wan-Ling, Chang, Chin-Chia, Fang, Jau-Shiung, Cheng, Yi-Lung

Journal:

Materials Chemistry and Physics

Year:

2021

File:

PDF, 4.34 MB

2021

40

Chemical-Structure Evolution Model for the Self-Assembling of Amine-Terminated Monolayers on Nanoporous Carbon-Doped Organosilicate in Tightly Controlled Environments

Fang, Jau-Shiung, Yang, Tzu-Ming, Pan, Yen-Chang, Lai, Guan-Yu, Cheng, Yi-Lung, Chen, Giin-Shan

Journal:

Year:

2020

File:

PDF, 6.29 MB

2020

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